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    PACK EXPO welcomes IOPP as conference partner

    Sept. 1, 2010
    PMMI announces that the Institute of Packaging Professionals (IoPP) will present The Packaging Learning Center conference program at PACK EXPO International

    PMMI announces that the Institute of Packaging Professionals (IoPP) will present The Packaging Learning Center conference program at PACK EXPO International 2010, to be held October 31 to November 3 at McCormick Place in Chicago. The program, which runs November 1 to 3, includes sessions that will focus on topics ranging from sustainability to food safety. End users, industry consultants, and suppliers will lead the sessions, open to all show attendees. Details are available on packexpo.com, under the Conference tab.

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