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Silver-filled epoxy- Master Bond Inc.

May 3, 2010
The epoxy bonds dissimilar substrates at room temperature with minimal shrinkage.

EP21TDCSFL two-component, room-temperature-curing, silver-filled, epoxy has a 1:1 mix ratio by weight or volume and can be applied on vertical surfaces with minimal sagging. It cures at room temperature or more rapidly at elevated temperatures and is 100% reactive. The adhesive has elongation over 60%, tensile shear strength over 1,500 psi, T-peel strength over 30 pli, volume resistivity over 10-3 ohm-cm, and thermal conductivity of 11 BTU/in/ft²/hr/°F. It works between 4 K and 250°F.
EP21TDCSFL has low shrinkage and bonds metals, glass, ceramics, rubbers and many plastics as well as dissimilar substrates that are being thermally cycled and shocked. The adhesive comes in half-pint, pint, quart, and gallon kits as well as premixed and frozen syringes.

Master Bond Inc., 154 Hobart St., Hackensack, NJ 07601, (201) 343-8983, www.masterbond.com

About the Author

Jessica Shapiro

Jessica serves as Associate Editor - 3 years service, M.S. Mechanical Engineering, Drexel University.

Work experience: Materials engineer, The Boeing Company; Primary editor for mechanical and fastening & joining.

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