Machine Design
Cryogenic Epoxy - Master Bond Inc.

Cryogenic Epoxy - Master Bond Inc.

EP29LPSP two-component epoxy adhesive/sealant withstands temperatures down to 4 K and cryogenic shocks such as cooling from room temperature to liquid helium temperatures in 5 to 10 min. It cures with a low exotherm at room temperatures or at 130-165°F for 6-8 hr. The epoxy bonds well to metals, glass, ceramics, and some plastics. It resists chemical attack and is optically clear.
EP29LPSP has a tensile strength of 6.5 ksi and a tensile modulus over 375 ksi. The cured epoxy's volume resistivity is over 1015 ohm-cm, and its dielectric constant is 3 to 4. It has Shore D hardness over 65.
EP29LPSP has a mix ratio of 100:65 by weight and a mixed viscosity of 400 cps. It comes in pint, quart, gallon, and 5-gal kits  as well as syringe applicators.

Master Bond, Inc., 154 Hobart St., Hackensack, NJ  07601, (201) 343-8983,

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