Dielectric Silicone Gels

    June 21, 2007
    EPM-2480, EPM-2481, and EPM-2482 dielectric gels are for encapsulation of chip packages in devices where outgassing-related contamination poses a problem.

    They cure into a soft, compliant silicone that reduces stress on electronic assemblies during temperature cycling. They also protect against environmental factors and shock.

    EPM-2480 and EPM-2481 are based on dimethyl silicone systems. EPM-2480 has a lower viscosity and is firmer than EPM-2481. EPM-2482 is based on a diphenyl-dimethyl silicone system, which gives it better temperature stability. The gels are two-part systems that come in 50-gm and 50-ml kits.

    NuSil Technology LLC, 1050 Cindy Lane, Carpinteria, CA 93013, (805) 6848780, nusil.com/dielectrics

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