The process accommodates package sizes down to 0402 and 0.5-mm-pitchleaded packages. To keep the circuits thinner and more flexible, the process uses adhesive-less construction. For additional support and strain relief, polyimide or epoxy-glass stiffeners can be laminated in place. Laser-processing capability supports precision drilling of hole sizes down to 0.002-in. diameter for microvia and blindvia multilayer circuits. Selective plating of gold and tin lead allows for multiple attachment methods on the same circuit. The circuits are used in medical device, medical implant, diagnostic ultrasound, telecommunications, and patient-monitoring applications.