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Machine Design

Thermal-Interface Material

EPM-2493 is a low-outgassing, thermal-interface material designed to meet the challenges of hightemperature and high-stress operating conditions in electrical packaging.

The easy-to-dispense electronic-packaging material (EPM) flows easily through dimensionally intricate electronic configurations. The material's lowoutgassing property is suitable for electro-optic systems where contamination is a concern. EPMs were developed to address contamination issues in dense electronic systems where manufacturing and operating environments can cause drastic temperature cycling, resulting in encapsulant embrittling or outgassing.

NuSil Technology LLC, 1050 Cindy Lane, Carpinteria, CA 93013, (805) 684-8780,

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