EPM-2493 is a low-outgassing, thermal-interface material designed to meet the challenges of hightemperature and high-stress operating conditions in electrical packaging.
The easy-to-dispense electronic-packaging material (EPM) flows easily through dimensionally intricate electronic configurations. The material's lowoutgassing property is suitable for electro-optic systems where contamination is a concern. EPMs were developed to address contamination issues in dense electronic systems where manufacturing and operating environments can cause drastic temperature cycling, resulting in encapsulant embrittling or outgassing.