Machine Design

UV And Heat-Curable Epoxy

A dual cure, UV/heat epoxy system, UV15D90, is designed for bonding, sealing, coating, and potting.

The low-viscosity compound is easy to apply, requires no mixing, is 100% solid, contains no solvents or volatiles, is not inhibited by oxygen, and has low shrinkage upon cure. The epoxy can cure in shadowed areas by supplemental heat curing at 80°C for 15 to 30 min. Straight UV curing for thicknesses of 0.010/0.02 in. takes place in seconds using UV light at 365 nm with 30 to 40 mW/cm 2 of energy. Postcuring at 125 to 135°C for 15 to 30 min increases the Tg to 130°C from the 90°C with straight UV cure. The epoxy adheres well to metals, glass, ceramics, and most plastics. Benefits include: superior chemical resistance; >70 Shore D hardness; elongation after cure of 3 to 4%; tensile strength of >4,200 psi, tensile modulus of 120,000 psi, and a 1.517 refractive index.

Master Bond Inc., 154 Hobart St., Hackensack, NJ 07601, (201) 343-8983,

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