The selection process of an adhesive, coating or potting compound can pose a few challenges for engineers. Some of these include adhesion, temperature and thermal cycling resistance...

Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and...

Master Bond formulates high-quality, innovative compounds for the laser, optics, and photonics industries. Our goal is to help engineers meet specific requirements for their bonding...

Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition...

Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. Supreme...

Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies...

Master Bond EP3HT-LO is a single component, non-premixed & frozen, heat cured epoxy, with an unlimited working life at room temperature. This system passes ASTM E595 tests for...

Master Bond EP30HT-LO is a moderate-viscosity, two-component, epoxy system that can be cured at room temperature, or at elevated temperatures for a faster cure. It can bond to...

Master Bond and STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporized Hydrogen Peroxide (VHPTM) using V-PRO® s2 Low ...

Overview Master Bond UV10TKLO-2 is a one-component UV-curable system for high-performance bonding, sealing, and encapsulation applications. It meets NASA’s specifications...

Master Bond EP21ARHTND-2 is a two-part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The system’s chemical resistance was...

Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts since...