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UV-Curing One-Part Epoxy Meets NASA specs for low outgassing

A new single component epoxy from Master Bond, EP17HTND-CCM, is neither premixed or frozen, and is more convenient to handle, apply, and store than two-component glob-top epoxies. This black, heat curable compound has a flowable paste consistency ideal for glob-top, chip coating, and bonding applications. It meets NASA low outgassing specifications and is serviceable from -80° to 600°F )-62° to +316°C). The adhesive forms high-strength bonds to a wide variety of similar and dissimilar substrates such as metals, ceramics, plastics, composites, and various circuit board materials.

EP17HTND-CCM is thermally conductive and electrically non-conductive even upon exposure to hostile environments. Its high-volume resistivity is over 1015ohm-cm at 75°F and over 1012ohm-cm at 400°F. Its thermal conductivity is 9-10 BTU-in/ft2-hr-°F (1.4423 W/(m-K)) at 75°F. It also resists many chemicals including acids, bases, salts, fuels, oils and many solvents.

Formulated for various electronic applications, the adhesive cures in 1 to 2 hours at 350°F (175°C) with a relatively low exotherm upon curing. It can be dispensed from a syringe, either manually or with an automatic dispenser. It is available for use in common size syringes ranging from 10 to 30 cc. For storage, simple refrigeration at 40-45°F is recommended.

Master Bond, 201-343-8983,

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