Pack Expo International will get its 2022 conference and trade show started on Sunday, Oct. 23 with a look at the future products and solutions that will lead the packaging industry into the future.
The four-day Pack Expo 2022 will take place at Chicago’s McCormick Place from Oct. 23-26. The annual event is produced by PMMI, The Association for Packaging and Processing Technologies. The show floor opens at 9 a.m. daily, but a special event will begin even earlier on Oct. 23 that will focus on the next generation of packaging.
The Emerging Brands Summit will match new brands with experts in manufacturing and packaging to develop a blueprint to scale operations. This new one-day event is happening from 8 a.m. to 5:30 p.m. in McCormick Place, Room S100.
Networking opportunities, tabletop exhibits and educational sessions provide information for brand leaders. Attendees also can meet with advisors, participate in group discussions and explore supplier exhibits.
“With the addition of the Emerging Brands Summit, coupled with the many networking events at this year’s show, PACK EXPO International has become the packaging and processing industry’s meeting place — virtually a one-stop-shop to meet with key industry experts, see critical technology, and connect with peers,” said Laura Thompson, vice president, trade shows for PMMI, in a press release. “Attendees will not only see new innovations from world-class exhibitors but will also learn from on-floor education sessions, experience interactive show features such as PACK to the Future, connect with future packaging leaders at several student-focused events, and so much more.”
“There is no better place than PACK EXPO International to make the critical connections needed to advance your business,” says Jim Pittas, president and CEO, PMMI. “Attendees will have an unprecedented number of opportunities to share innovations, connect with colleagues, hear from experts, and see machinery in action and the latest packaging materials at this year’s show.”
What’s New at Pack Expo: Packaging, CPG Automation
More than 2,000 exhibitors will display the latest innovations for the packaging and consumer packaged goods (CPG) applications over 1.2 million sq ft of exhibit space at McCormick Place. Among this year’s innovations on the show floor will be:
Emerson will be exhibiting in booth N-4736, where they will showcase their solutions for the future of connected manufacturing in food and beverage packaging. In the booth, Emerson will feature products and demos that improve productivity, enhance efficiency and sustainability and increase OEE in food and beverage and consumer packaged goods applications. In addition, Melissa Stiegler, Director of Food and Beverage at Emerson will present "Reduce Waste & Increase Efficiency in Clean-in-Place Process" at Innovation Stage 1 (N-4560) on Tuesday, October 25 at 12 pm.
Bosch Rexroth will exhibit in booth S-1620 where they will showcase complete factory automation solutions that boost CPG productivity. The booth will feature the latest technology demos and exhibits that highlight Rexroth's broad range of factory automation technology, including open control systems, plug-and-play smart mechatronics, autonomous mobile robots (AMR) and flexible conveyors.
Get a Handle on the Automation Timeline
Ever wonder where your company lands on the curve in automating production? Find the answer and other interesting facts in this infographic from PMMI.