The HPL high-power lighting dielectric joins the Thermal Clad metal-core PCB line. Specifically formulated for high-power lighting LED applications, the 0.0015 in. dielectric withstands high temperatures with a glass transition of 185°C and thermal performance of 0.30°C/W (RD 2018).
Thermal Clad minimizes thermal impedance and conducts heat more effectively and efficiently than standard printed-wiring boards. The device’s lower operating temperature extends LED life and durability for high-power lighting applications. The HPL is available in scored array circuits, scored singulated circuit, punched singulated parts, and in LED standard stars and squares configurations.
The Bergquist Co., 18930 W. 78th St., Chanhassen, MN 55317, (800) 347-4752, http://www.bergquistcompany.com/
