How Do You Use EP4EN-80 for Potting & Encapsulation Applications?

Related To: 
Jan. 6, 2026
With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound can be used while observing its flowability and ease of use.
Sign up for our eNewsletters
Get the latest news and updates

Related

Layer-Driven Valve Design Enables Production of Soft-Robotics at Scale
Making Piezoelectronics Work for You
Guide to Drive Technology in Wastewater Treatment Plants
Sponsored
The Flying Swiss Army Knife
Sponsored

Voice Your Opinion!

To join the conversation, and become an exclusive member of Machine Design, create an account today!