Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically...
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest...
Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition...
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. Supreme...
Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies...
Master Bond EP3HT-LO is a single component, non-premixed & frozen, heat cured epoxy, with an unlimited working life at room temperature. This system passes ASTM E595 tests for...
Master Bond and STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporized Hydrogen Peroxide (VHPTM) using V-PRO® s2 Low ...
Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts since...
December 19, 2025 - Hackensack, NJ - Master Bond Supreme 10HTLV is a one part, non-frozen, heat cured epoxy formulated for demanding structural bonding applications. This...
MasterSil 800Med is a one component, moisture curing silicone specifically designed for medical device manufacturing. It passes ISO 10993-5 testing for non-cytotoxicity, confirming...
Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The ...
Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations ...
Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product...
Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity...
Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity...